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Shenzhen ETA Electronic Equipment Co., Ltd.

YAMAHA Chip Mounter, SMT Chip Shooter, Stencil Printing Machine manufacturer / supplier in China, offering YAMAHA M10 SMT Chip Shooter, Large Size 8 Heating Zone Reflow Oven, Automatic with Reflow Oven with PCB Soldering Machine and so on.

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YAMAHA M10 SMT Chip Shooter

FOB Price: Get Latest Price
Min. Order: 1 Piece
Production Capacity: 1000 Sets/Year
Transport Package: Wooden Case
Payment Terms: L/C, T/T, Western Union, Paypal, Money Gram

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Basic Info
  • Model NO.: YAMAHA M10
  • Precision: High Precision
  • Warranty: 12 Months
  • Type: High-speed Chip Mounter
  • Specification: CE/UL
  • HS Code: 8515190000
  • Condition: New
  • Certification: ISO, CE
  • Automatic Grade: Automatic
  • Trademark: YAMAHA
  • Origin: Japan
Product Description
Yamaha M10 SMT chip shooter with highest large board handling capability
Handling larger board as standard
Revolutionary and unique new features
included as standard ensure the
M10 evolves into the ultimate
super-flexible multi-purpose machine.
 
Max board size: 980*510mm
Feeder capacity: 72 lanes(8mm tape conversion)
Applicable components:01005 to 120*90mm
Machine width: 1,250mm
 
 
New Multi-Conveyor System
providing the highest large board handling capability on the market
With no mechanical board stoppers, utilizing a laser sensor to measure the board length, thus providing optimum board position for efficient component placement, regardless of size or shape .The Multi-Conveyor System can quickly and flexibly adapt to production changes with minimum operator activity.
 
Max. 980*510mm board can be handled as standard.
 
 
Hybrid placement functions
Dispense heads that can be exchanged with mount heads are newly developed. It becomes possible to make 3-D placement where solder paste dispensing and component mounting can be alternately performed. Hybrid placement is now realized. The removable Dot Station can be fitted to the feeder bank.
Wide ranging component handling capacity and high feeder capacity
Handling a full range of components from 01005 to 120 x 90mm as standard.
(No optional camera needed)
 
Image capture of chips can be performed with max. speed of 3,000mm/sec.
 
High speed image capture and recognition are realized in accordance with component size. Introducing "D-SCAN" - New image capture system from i-PULSE.
3 type of head variations.Max.component height 30mm as standard (board thickness + component height)
 
In pursuit of ultimate flexibility and fast & easy setup
New CFB-36E for use with F3 Electric Feeders
The CFB-36E F3 Feeder Bank Changer, the CFB-36 F1/F2 Feeder Bank Changer and the CTF-36C Changeable Tray Feeder can be exchanged with each other. The CFB-36E and the CFB-36 can also be fitted to the same machine.
 
New CTF-36C Changeable Tray Feeder.
Utilizing multi-cassette tray handling with intelligent
function ensures high-speed production changeover.
In pursuit of high accuracy placement
Gripper nozzles newly added in P type nozzles
of light-weight and low-impact.
Odd-form handling capacity further increased.
 
Component coplanarity sensor (Option).
Floating leads are inspected and defective
components are detected prior to placement.
 
Placement force is fully controlled in real time
to reduce stress to components.
Floating leads are inspected and defective components are detected prior to placement.
 
Placement height measuring laser unit as standard.
Board warp is measured with laser to ensure placement height is corrected before components are mounted.
 
Flux Station
The flux station can be fitted on the feeder bank, handling flux transfer. Now ready for applications beyond the field of SMT.
 
Specifications
 
ItemSpecification
Board size (with buffer unused)Min.L50×30mm to Max. L980×W510MM *1
Board size (with input or output buffer used)Min.L50×30mm to Max. L420×W510MM
Board size (with input and output buffers used)Min.L50×30mm to Max. L330×W510MM
Board thickness0.4-4.8mm
Board flow directionLeft to right (Std)
Board transfer speed Max 900mm/sec
Placement speed (4 heads+ 4 theta) Opt. Cond.0.15sec/CHIP (24,000CPH)
Placement speed (6 heads+ 2 theta) Opt. Cond.0.15sec/CHIP (30,000CPH) *2
Placement speed (4 heads+ 1 theta) IPC985019,000CPH
Placement speed (4 heads+ 4 theta) IPC985019,000CPH
Placement speed (6 heads+ 2 theta) IPC985023,000CPH*2
Placement accuracy A (CHIP+/-0.040mm
Placement accuracy B (IC+/-0.025mm
Placement angle+/-180 degrees
Z axis controlAC servo motor
Theta axis controlAC servo motor
Component heightMax 30mm*3(pre-placed components:max 25mm)
Applicable components01005-120*90mm,BGA,CSP,connector,etc.
Component package8-56mm tape(F1/F2 feeders),8-88mm tape(F3 electric feeders),stick,tray
Drawback checkVacuum check and vision check
Screen languageEnglish,Chinese,Korean,Japanese
Board positioningBoard grip unit,front reference,auto conveyor wideth adjustment
Component typesMax 72 types(8mm tape),36 lanes*2
Transfer height900 +/- 20mm
Machine dimensions,weightL1250*D1750*H1420mm, Approx. 1,150KG
Power3-phase 200.208/220/240/380/400/416/440v +/- 10%
Max consumption,capacity1.1kw,5.5KVA
Aipr pressure,consumption0.45Mpa,50(4 heads) or 75 (6 heads) L/min A.N.R.
 
*1: Max. 950mm for 6 head configuration
*2: Optional item
*3: Board thickness + Component height =Max 30mm
 
YAMAHA M10 SMT Chip Shooter
YAMAHA M10 SMT Chip ShooterYAMAHA M10 SMT Chip Shooter
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