PCB Cooling buffer post reflow oven then FIFO
1.Using three-color LED lights, LED membrane switch touch panel.
2.Special aluminum body with a host connection,better understanding the working state of MAGAZINES.
3.Man-machine operation key surface, convenient and intuitive.
4.Panasonic PLC control, multi-function electrical circuit and program design, stable performance, to ensure the production line flow smoothly.
5.The income table with cooling function.
6.Can save 25pcs boards, optional 50pcs,memory board box with air-cooled devices.
7.With 3 models,FIFO, last out, through.
8.Standard SMEMA communication interface can be connected with other automation equipment
9.Board protection system keeps the PCB boards from pushing bad, reduce process losses.
|The equipment is used before AOI,after reflow oven for hoding and cooling PCBs|
|Pcb size (mm)||50*50~420*250|
|Working height (mm)||900±20(std)|
|PCB load time||6.0 sec|
|Quantity of boards||25pcs (optional 50pcs)|
|Power||AC 110/220V±10V, 50/60HZ|
|Weight (KG)||230 KG|
|Air compressor||4-6 bar|
|Compressed air flow||Max 10L/Min|
|Thickness of PCB||0.6-4mm|
|Conveying belt||4mm belt|