Medium lead free smt reflow oven A600
Model: A600 MID-sized Lead-free Reflow Oven(6-zone)
Brief: Lead-free reflow soldering
> Eight groups of top and bottom forced hot air convection heating zones.
> Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air convection.
> Independent temperature control in each zone to ensure temperature uniformity within the process tunnel.
> Power consumption savings of 1/3 as compared to other systems.
> Patented motorized blower in each zone is designed to ensure stable air pressure, withstand high process temperature and is disturbance-free.
> Audible and light tower alarm for temperature limits and blower malfunction.
> Fast start-up (within 20 minutes) from room temperature to work temperature due to the high efficiency of the motorized heating plates.
> Two (2) groups of air fans convection cooling zones.
> Mesh belt conveyor system
> Closed-loop computer control of the conveyor provides a precise and repeatable reflow process.
> PC control system with windows based control software.
>Lenove Computer and Siemens PLC
> Integrated UPS will be automatically activated in case of main power failure and will keep control PC and conveyor running for minimum 5 minutes to send out PCBs inside the oven tunnel.
> Three (3) profiling ports and integrated profiling software are designed for convenient temperature profiling.
> Swing arm control PC station
> Two (2) emergency stop switches
> Two (2) exhaust port
|S - Standard, O - Option, M - Manual, A - Auto, N/A - Not Availible)|
|Standard Color||Computer Grey|
|Number Of Heating Zones||Up5/Bottom5||Up6/Bottom6||Up8/Bottom8|
|Length Of Heating Zones||1900mm||2300mm||2600mm|
|Heating pattern||Up:Hot air,Bottom:Infared|
|Number of Cooling Zones||1|
|Length Of Cooling Zones||300mm|
|Exhaust Volume||10M3/minx2 Exhausts|
|Electric Supply Required||N/A||N/A||Lenovo|
|Power For Warm Up||Standard||Standard||Standard|
|Power Consumption||3phase,380V 50/60Hz |
|Warming Time||Approx.25 minute|
|Temp. Setting Range||Room Temp.-- 300 degree|
|Temperature Control Method PID + SSR ||S|
|Temperature Control Precision||± 1.0 degree|
|Temperature Deviation on PCB||± 1.5 degree|
|Commutated Element ||Plate ||Plate ||Aluminium Alloy Plate |
|Process Data & Status Storage||N/A||N/A||Standard|
|Board Dropped Alarm||N/A|
|Electrical SMEMA Interface||N/A|
|Max.Width Of PCB||300mm|
|Components Clearance||Top/ Bottom is 20mm|
|Converyor Speed Range||300~2000mm/min|
|Lubrication Auto-Afflux ||N/A|
|Temp. Thermocouple Slot ||Standard|
|Cooling Method ||Air fan |